INDUSTRY

Semiconductor & Electronics

Wafer carriers, precision components and anti-static modified parts, with clean production and full-dimensional inspection.

THE CHALLENGE

Why this application is a material problem

Semiconductor tooling tolerates neither contamination nor dimensional drift. We mold PEEK, PEI and LCP parts for wafer handling, test sockets and high-frequency connectors, in a flow that keeps cleaning, handling and inspection under control.

Discuss Your Part

Typical parts we mold

Wafer carriers and handling fixtures
Test sockets and high-frequency connectors
Anti-static (ESD) modified components
Precision structural parts

Materials we work in

PEEK, PEI, LCP, PPS

What you get

Mirror-finish cavities where required, low-shrinkage LCP grades for tight-pitch parts, and full-dimension inspection on every first article.

OTHER INDUSTRIES

Where else we work

Humanoid Robots

Joint frames, gears and bearing cages in PEEK — the material that makes weight reduction possible.

Medical Devices

Sterilization-resistant, biocompatible parts in PEEK and PPSU, with medical-grade sourcing and documented quality.

New-Energy Vehicles

High-voltage connectors, sensor brackets and battery-system parts in PPS, PPA and PEEK.

Have a 3D drawing? DFM feedback and quotation in 48 hours.

Send STEP / UG / STP files by email or WeChat — you get material analysis, gating proposal, cycle estimate and mold price in one reply.

Request a Quote

Specialty engineering plastics only — PEEK, PEI, PPS, PPSU, PSU, PES, LCP
Barrel 360–400 °C, mold 160–220 °C — built for PEEK's 343 °C melt
Rapid tooling delivers first samples in 7–15 days, 1–5,000 pcs
Moldflow first, first-article FAI report, key dimensions CPK ≥ 1.33